Pulsetech

The mold surface temperature has great influence forplastic injection molding. With high mold surface temperature,the surface quality of part will be better, but thecooling time will increase and accordingly the cycle timewill rise as well. The decreasing of the mold surfacetemperature will reduce the cooling time, but there is nobenefit for the surface quality of part.

Traditional cooling and pulsed cooling are used for themold temperature control without changing coolingsystem design. With the traditional cooling method,constant coolant flow is employed in the overall moldingprocess. Generally, the coolant temperature is almost

the same as the mold temperature by this approach. For the pulsed cooling method, applying variable coolantflow time to interrupt cooling processing shows the cooling time decrease, but the mold surface temperaturekeeps high. By means of less cooling time, lowering the usage of power contributes to saving more.

As known the conventional process with stable mold temperature and constant coolant flow, the requiredcooling time will stable as well. However, if coolant flow stops during cooling phase, the cooling time mustincrease to reach the ejection temperature. And pulsed cooling is adopted for changing cooling time andpulsed cooling time to find out the mold open and close temperatures close to those required for conventionalcooling.

REF ARTICLE: IMPROVE COOLING EFFECT OF INJECTION MOLDING BY PULSED-COOLING METHODShia-Chung Chen1,2, Pham Son Minh1,2,I-Sheng Hsieh3, Yan-Chen Chiou3 1Departmentof Mechanical Engineering, Chung Yuan Christian University, Taiwan, R.O.C. 2R&D Center for Mold and Molding Technology, Chung Yuan Christian University, Taiwan, R.O.C. 3CoreTechSystem (Moldex3D) Co., Ltd., ChuPei City, Hsinchu, Taiwan, R.O.C.



Model   PULSETECH 4 PULSETECH 6 PULSETECH 12 PULSETECH 24 PULSETECH 36 PULSETECH 48
Temperature range oC  -5 /90
Operating modes   Temperature monitoring, Temperature control, Pulse cooling, Low and High tempereture molding, Rapid cool and heat
Fluid   Water
Circuit on 4 6 12 24 36 48
Cooling type   Indirect
Cooling capacity kw 26 26 50 80 80 80
Heating capacity kw 9 12 18 24 36 48
Flow measurement per circuit l/min. 0,3 / 40
Switching accuracy   ±1% 
Contoller specifications   Dual core processor 1.86 GHz, 1M L2 Cache, 2Gb DDR 3 RAM
Operator interface   15" TFT LCD Touch screen 
Mold file storage   Up to 1000 mold files, with memory function
Mold circuit connections   1/2"
Cooling circuit connections   1" 1 1/2"
Power supply   380 V 50 Hz 3 Phase
Document Name Document
Pulsetech Brochure PULSEtech ENG.pdf